5947.1:
Low-temperature thick-film dielectrics stabilised by reaction with a nanocrystalline powder
Abstract
The goal of this project is to develop stable low-temperature thick-film dielectrics for metallic substrates which cannot be heated to high temperatures: mainly aluminum, but also titanium alloys and certain steels. The chief intended application is in force and pressure sensing. Applications are also envisioned in heaters.
To achieve our goals, we intend to mix a low melting point glass with a nanoscale powder. Glass and powder will be formulated to react upon melting of the glass, so that the resulting product is much more stable. This allows further deposition of existing low-temperature thick-film resistors and conductors. The very fine powder will allow reaction – and stabilization – of the glass at the lowest possible temperature.